Universal Şablon Bemsis

 

baskiliPCB - PRINTED CIRCUIT 


Main Services;

• Low quantity Sample Multilayer PCB
• Medium or High Volume Mass Prod. Multilayer PCB
• Al. PCB
• FPC
• Membrane Switch
• Frameless/Framed SMT Stencil Steel
• PCB/FPC Engineering Design Facilities


Your sample and mass production needs are provided quickly and economically from reliable confirmed suppliers.

PCB Design and Manufacturing Capabilities

Layers 2-16 Layers
Max. Board Size 864 x 610 mm (34" x 24")
Min. Board Thickness 0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers)
Max. Board Thickness 315mil (8mm)
Max. Copper Thickness 19oz/Inner Layer: 12oz/Outlayers
Min. Inner Line Width / Space 4mil (0.1mm) / 4mil (0.1mm)
Min. Outer Line Width / Sapce 4mil (0.1mm) / 3.5mil (0.089mm)
Min. Finish Hole Size 6mil (0.15mm)
Max. Aspect ratio 12:1
Minimum via hole size and pad via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via
Minimum hole tolerance ±0.05mm (NPTH), ±0.076mm (PTH)
Finished hole size tolerance(PTH) ±2mil (0.05mm)
Finished hole size tolerance(NPTH) ±1mil (0.025mm)
PTH hole copper thickness Min. 25um (1.0mil)
Hole Position Deviation ±2mil (0.05mm)
Outline Tolerance ±4mil (0.1mm)
S/M Pitch 3mil (0.08mm)
Insulation Resistance 1 × 1012Ω
Thermal Shock 3 × [email protected] ℃
Warp and Twist ≤0.5%
Peel Strengh 1.4N / mm
Solder Mask Abrasion ≥6H
Flammability 94V - O
Impedance Control ±5%
Mini Solder mask Opening 0.05mm (2mil)
Mini solder mask coverage 0.05mm (2mil)
Mini solder dam 0.076mm (3mil)
Surface Finish Treatment Flash gold (Electrolytic), Electroless nickel Immersion gold (Electroless Ni/Au), 
Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead),
Hot Air Leveling (Lead- Free, RoHS), Carbon Ink, Peelable Mask, Gold Fingers (30μ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um).
G/F Au thickness 0.76um max ( 30u” max )
V-cut angle 30° 45° 60° , tolerence +/- 5°
Mini V-cut board thickness 0.8mm
V-cut remain thickness tolerance ±0.1mm
Profiling mode Routing & Punching
Profiling tolerance ±0.1mm (4mil)
E-TEST voltage 250 ± 5 V

 

 

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