PCB - PRINTED CIRCUIT
Main Services;
• Low quantity Sample Multilayer PCB
• Medium or High Volume Mass Prod. Multilayer PCB
• Al. PCB
• FPC
• Membrane Switch
• Frameless/Framed SMT Stencil Steel
• PCB/FPC Engineering Design Facilities
Your sample and mass production needs are provided quickly and economically from reliable confirmed suppliers.
PCB Design and Manufacturing Capabilities
| Layers | 2-16 Layers |
| Max. Board Size | 864 x 610 mm (34" x 24") |
| Min. Board Thickness | 0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) |
| Max. Board Thickness | 315mil (8mm) |
| Max. Copper Thickness | 19oz/Inner Layer: 12oz/Outlayers |
| Min. Inner Line Width / Space | 4mil (0.1mm) / 4mil (0.1mm) |
| Min. Outer Line Width / Sapce | 4mil (0.1mm) / 3.5mil (0.089mm) |
| Min. Finish Hole Size | 6mil (0.15mm) |
| Max. Aspect ratio | 12:1 |
| Minimum via hole size and pad | via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via |
| Minimum hole tolerance | ±0.05mm (NPTH), ±0.076mm (PTH) |
| Finished hole size tolerance(PTH) | ±2mil (0.05mm) |
| Finished hole size tolerance(NPTH) | ±1mil (0.025mm) |
| PTH hole copper thickness | Min. 25um (1.0mil) |
| Hole Position Deviation | ±2mil (0.05mm) |
| Outline Tolerance | ±4mil (0.1mm) |
| S/M Pitch | 3mil (0.08mm) |
| Insulation Resistance | 1 × 1012Ω |
| Thermal Shock | 3 × 10Sec@288 ℃ |
| Warp and Twist | ≤0.5% |
| Peel Strengh | 1.4N / mm |
| Solder Mask Abrasion | ≥6H |
| Flammability | 94V - O |
| Impedance Control | ±5% |
| Mini Solder mask Opening | 0.05mm (2mil) |
| Mini solder mask coverage | 0.05mm (2mil) |
| Mini solder dam | 0.076mm (3mil) |
| Surface Finish Treatment | Flash gold (Electrolytic), Electroless nickel Immersion gold (Electroless Ni/Au), Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead), Hot Air Leveling (Lead- Free, RoHS), Carbon Ink, Peelable Mask, Gold Fingers (30μ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um). |
| G/F Au thickness | 0.76um max ( 30u” max ) |
| V-cut angle | 30° 45° 60° , tolerence +/- 5° |
| Mini V-cut board thickness | 0.8mm |
| V-cut remain thickness tolerance | ±0.1mm |
| Profiling mode | Routing & Punching |
| Profiling tolerance | ±0.1mm (4mil) |
| E-TEST voltage | 250 ± 5 V |
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